±0.003 mm Tolerance CNC Machining for Alumina Ceramics, Silicon Carbide

At Minnexon, we specialize in ultra-precision CNC machining for some of the hardest and most demanding engineering materials in the world — including alumina ceramic, single-crystal alumina (sapphire), silicon carbide ceramic, and single-crystal silicon carbide (moissanite).

 

With micro-hole drilling down to 0.025 mm and tolerances as tight as ±0.003 mm, we deliver components for industries where precision, material performance, and reliability are non-negotiable.

Materials We Machine

Our advanced CNC, laser, and ultrasonic machining systems are capable of processing materials with extreme hardness:

MaterialCompositionMohs HardnessKey Properties
Alumina CeramicAl₂O₃~9High hardness, excellent wear resistance, electrical insulation
Sapphire (Single-Crystal Alumina)Al₂O₃ (single crystal)9Extreme scratch resistance, optical transparency, high thermal conductivity
Silicon Carbide CeramicSiC9–9.5Exceptional thermal conductivity, chemical resistance, and hardness
Moissanite (Single-Crystal Silicon Carbide)SiC (single crystal)9.25Ultra-high hardness, thermal stability, and optical clarity

Our capability to consistently machine materials close to diamond in hardness (Mohs 9–9.5) makes Minnexon a trusted partner for industries that require precision in ultra-hard substrates.

Technical Capabilities

SpecificationValue
Minimum Hole Diameter0.025 mm (25 μm)
Maximum Hole Count per Workpiece35,004
Tolerance – Entrance Side±0.003 mm
Tolerance – Exit Side±0.005 mm
Maximum Depth by Hole DiameterSee Table Below
Minimum Hole Spacing0.010 mm

Maximum Depth by Hole Diameter:

Hole DiameterMaximum DepthDepth/Diameter Ratio
25 μm0.20 mm8:1
30 μm0.30 mm10:1
35 μm0.35 mm10:1
40–50 μmCalculated10–16:1
≥ 55 μmCalculated12–16:1

Why Choose Minnexon for Ultra-Hard Material Machining?

  • Extreme Precision: ±0.003 mm / ±0.005 mm tolerance control

  • Ultra-Hard Material Expertise: Sapphire, silicon carbide, alumina ceramics, and moissanite machining

  • High Production Capacity: Up to 35,004 holes per workpiece

  • Micro-Scale Capability: Down to 25 μm holes with ultra-close spacing

  • Material-Specific Engineering: Optimized processes for each material’s thermal, optical, and mechanical properties

Industries We Serve

  • Electronics & Semiconductors: High-density interconnects, micro-vias, RF and microwave components

  • Medical Devices: Microfluidic channels, precision optical windows, and implant components

  • Aerospace & Defense: Radar substrates, high-temperature insulators, optical targeting components

  • Optics & Photonics: Precision apertures, laser windows, optical domes

Get in Touch

We will provide you with feedback within 24 hours.