At Minnexon, we specialize in ultra-precision CNC machining for some of the hardest and most demanding engineering materials in the world — including alumina ceramic, single-crystal alumina (sapphire), silicon carbide ceramic, and single-crystal silicon carbide (moissanite).
With micro-hole drilling down to 0.025 mm and tolerances as tight as ±0.003 mm, we deliver components for industries where precision, material performance, and reliability are non-negotiable.
Our advanced CNC, laser, and ultrasonic machining systems are capable of processing materials with extreme hardness:
Material | Composition | Mohs Hardness | Key Properties |
---|---|---|---|
Alumina Ceramic | Al₂O₃ | ~9 | High hardness, excellent wear resistance, electrical insulation |
Sapphire (Single-Crystal Alumina) | Al₂O₃ (single crystal) | 9 | Extreme scratch resistance, optical transparency, high thermal conductivity |
Silicon Carbide Ceramic | SiC | 9–9.5 | Exceptional thermal conductivity, chemical resistance, and hardness |
Moissanite (Single-Crystal Silicon Carbide) | SiC (single crystal) | 9.25 | Ultra-high hardness, thermal stability, and optical clarity |
Our capability to consistently machine materials close to diamond in hardness (Mohs 9–9.5) makes Minnexon a trusted partner for industries that require precision in ultra-hard substrates.
Specification | Value |
---|---|
Minimum Hole Diameter | 0.025 mm (25 μm) |
Maximum Hole Count per Workpiece | 35,004 |
Tolerance – Entrance Side | ±0.003 mm |
Tolerance – Exit Side | ±0.005 mm |
Maximum Depth by Hole Diameter | See Table Below |
Minimum Hole Spacing | 0.010 mm |
Hole Diameter | Maximum Depth | Depth/Diameter Ratio |
---|---|---|
25 μm | 0.20 mm | 8:1 |
30 μm | 0.30 mm | 10:1 |
35 μm | 0.35 mm | 10:1 |
40–50 μm | Calculated | 10–16:1 |
≥ 55 μm | Calculated | 12–16:1 |
Extreme Precision: ±0.003 mm / ±0.005 mm tolerance control
Ultra-Hard Material Expertise: Sapphire, silicon carbide, alumina ceramics, and moissanite machining
High Production Capacity: Up to 35,004 holes per workpiece
Micro-Scale Capability: Down to 25 μm holes with ultra-close spacing
Material-Specific Engineering: Optimized processes for each material’s thermal, optical, and mechanical properties
Electronics & Semiconductors: High-density interconnects, micro-vias, RF and microwave components
Medical Devices: Microfluidic channels, precision optical windows, and implant components
Aerospace & Defense: Radar substrates, high-temperature insulators, optical targeting components
Optics & Photonics: Precision apertures, laser windows, optical domes
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